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ESP32-C3 SuperMini With 3D Case Stamp

3D-Printed Case with ESP32-C3 SuperMini Stamp – Compact, Precise, and Functional

Designed by ERMOS in Germany

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3D-Printed Case with ESP32-C3 SuperMini Stamp – Compact, Precise, and Functional

This high-quality 3D-printed enclosure provides reliable protection for your ESP32-C3 SuperMini Board while keeping dimensions to a minimum. The Boot and Enable buttons remain easily accessible. By s…

This high-quality 3D-printed enclosure provides reliable protection for your ESP32-C3 SuperMini Board while keeping dimensions to a minimum. The Boot and Enable buttons remain easily accessible. By simply breaking out the bottom covers, you can access all of the board’s pins whenever needed.

The case consists of two interlocking parts that can be assembled and separated without tools – perfect for prototyping or quick module swaps.

Specifications:

Material: PLA (Polylactide)

Dimensions: 28 × 23 × 8 mm

ESP32-C3 SuperMini is included!

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