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CMP polishing for Lithium niobate wafers (up to 10 sample) (1 in diameter, 200-375um thickness). The specs:: -wafer size: 2in or 3in. -start thickness 375um. -finish thickness 150-200um. Stage 1 Mac…
Read More…CMP polishing for Lithium niobate wafers (up to 10 sample) (1 in diameter, 200-375um thickness).
The specs::
-wafer size: 2in or 3in.
-start thickness 375um.
-finish thickness 150-200um.
Stage 1 Machine Type: Kemet 15 Lapping/Polishing machine Lap Plate: Cast Iron Abrasive Type/Grade: Kemox O-800S Aluminium oxide premixed slurry
Stage 2 Machine Type: KemCol 15 Machine Lap Plate: MRE short nap cloth Abrasive Type/Grade: Col-K (NC) CMP slurry
-final surface roughness Ra 0.5nm.
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Yong Meng | Sept. 8, 2021
Flea Market Item:
Any items bought in the Flea Market are not part of the Tindie Guarantee and therefore are 'Buyer Beware'. More info.
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