Breadboard spaced breakout for TSSOP28 packages with thermal management pads on the board. Originally designed for the DRV5388.Designed by ROSE_Platform in United States of America
What is it? This board was designed originally for some students using the DRV8825 motor driver IC, however a surplus was ordered. These can be used for a large amount of IC's fitting the TSSOP28 p...Read More…
This board was designed originally for some students using the DRV8825 motor driver IC, however a surplus was ordered. These can be used for a large amount of IC's fitting the TSSOP28 package size. This board also features large thermal pads to aid in heat dissipation. There are two versions of the board available. The Green PCB has added mounting holes for headers if you wish to electrically connect the exposed pad and large copper pours somewhere in your circuit. The finish is LEAD HASL.
We have had problems where we would like to evaluate TSSOP28 parts on a breadboard without the need to wait for a PCB. Hopefully this module can make it as easy to prototype with the surface mount parts as it has for us.
These breakout boards include an exposed pad along with a ton of heatsinking. The top and bottom copper pours are electrically connected to each other. On the Green PCB (With Exposed Pad Headers), we added the option to attach standard headers so that you can electrically connect the exposed pad to a part in your circuit (most of the time with these packages you need to connect the exposed pad to ground).
This was developed for the TSSOP28 DRV8825 IC, and can be used for any other chip with the same landing pads. Here is a link to the Driver IC which this was originally designed for. Specifically beginning at page 29 are the mechanical dimensions of the IC to make sure your chip can fit: DRV8825 . Here is a excerpt from the PDF.
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