This is a breakout board for 20-pin QFN chips (with 5 pins on each side). It has a 4x4mm footprint with 0.5mm lead pitch on one side, and a 3x3mm footprint with 0.45mm lead pitch on the other. This adapter breaks out a QFN-20 package IC into 0.1″ (2.54mm) spaced pins that match most breadboards and protoboards in the market.
This board features a central pad that can dissipate heat from high-power integrated circuits, like motor controllers and audio amplifiers. There is also a hole through the central pad that lets you drop some solder to ensure heat dissipation and conductivity up to the IC. This central pad is connected to a dedicated outer pad, so you can wire a connection to GND (if needed).
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