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Description The Allegro ACS712 provides economical and precise solutions for AC or DC current sensing in industrial, commercial, and communications systems. The device package allows for easy imple...Read More…
The Allegro ACS712 provides economical and precise solutions for AC or DC current sensing in industrial, commercial, and communications systems. The device package allows for easy implementation by the customer. Typical applications include motor control, load detection and management, switched-mode power supplies, and overcurrent fault protection. The device is not intended for automotive applications. For the automotive grade version, see ACS714.
The device consists of a precise, low-offset, linear Hall sensor circuit with a copper conduction path located near the surface of the die. Applied current flowing through this copper conduction path generates a magnetic field which is sensed by the integrated Hall IC and converted into a proportional voltage. Device accuracy is optimized through the close proximity of the magnetic signal to the Hall transducer. A precise, proportional voltage is provided by the low-offset, chopper-stabilized BiCMOS Hall IC, which is programmed for accuracy after packaging.
The output of the device has a positive slope (>VIOUT(Q)) when an increasing current flows through the primary copper conduction path (from pins 1 and 2, to pins 3 and 4), which is the path used for current sensing. The internal resistance of this conductive path is 1.2 mΩ typical, providing low power loss. The thickness of the copper conductor allows survival of the device at up to 5× overcurrent conditions. The terminals of the conductive path are electrically isolated from the sensor IC leads (pins 5 through 8). This allows the ACS712 current sensor IC to be used in applications requiring electrical isolation without the use of opto-isolators or other costly isolation techniques.
The ACS712 is provided in a small, surface mount SOIC8 package. The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes. Internally, the device is Pb-free, except for flip-chip high-temperature Pb-based solder balls, currently exempt from RoHS. The device is fully calibrated prior to shipment from the factory.
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